【薪資範圍】12-18萬
Qualifications
1.Experienced years : Longer than 3 years in EOL Process
2.Experienced areas : End of Line Process (Mold, Trim/Form, Sn Plating, LASER Marking, Laser Deflash), Preferred Design Career and Equipment Engineering Experience
3.Experienced jobs : Semiconductor Assembly Process Development, Equipment and Tooling set-up, process/equipment/material troubleshooting and control, Purchase spec/selection, Qualification for equipment and material, Experience of consulting on Leadframe design and understanding FOL area
4.Experienced packages: Semiconductor Packages. Highly Preferred Power discrete (like TO220, D-Pak, D2PAK) and Power module packages (like SPM, IPM, IGBT/Diode module)
Nationality : Chinese
Education: 4yrs college or preferred Master Degree, Preferred Mechanical Engineering
Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, JMP & Data analysis. Skilled Excel Spreadsheet and Power Point Presentation, AutoCAD
Other characteristics such as personal characteristics:Self motivated, independent, open mind to communicate, be willing to take risk and managing
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