FOP 封裝優勢
Advantages : • Small form factor • Low package profile • No substrate • High I/O density possible • Electrical performance • Thermal performance • Fab BEOL process at wafer level • Low warpage at high temperature • Compatible with dienode change and size shrinkage • Multichip and SIP
For Fan-out wafer and panel level packageing , 2basic process flow are encountered: the mold first and the RDL first approaches. By now, For the mold first process , a face down and a face up option exitsReconstituted Wafer ConcernCapillary Underfill PropertiesWafer Level Underfill Processing Compression Molding FOWLPENABLING TECHNOLOGIES FOR ADVANCED WLPFan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration