離子注入機：ion implanter
LSS理論：Lindhand Scharff and Schiott theory，又稱「林漢德-斯卡夫-斯高特理論」。
溝道效應：channeling effect
射程分布：range distribution
深度分布：depth distribution
投影射程：projected range
阻止距離：stopping distance
阻止本領：stopping power
標準阻止截面：standard stopping cross section
退火：annealing
激活能：activation energy
等溫退火：isothermal annealing
雷射退火：laser annealing
應力感生缺陷：stress-induced defect
擇優取向：preferred orientation
製版工藝：mask-making technology
圖形畸變：pattern distortion
初縮：first minification
精縮：final minification
母版：master mask
鉻版：chromium plate
幹版：dry plate
乳膠版：emulsion plate
透明版：see-through plate
高解析度版：high resolution plate, HRP
超微粒幹版：plate for ultra-microminiaturization
掩模：mask
掩模對準：mask alignment
對準精度：alignment precision
光刻膠：photoresist，又稱「光致抗蝕劑」。
負性光刻膠：negative photoresist
正性光刻膠：positive photoresist
無機光刻膠：inorganic resist
多層光刻膠：multilevel resist
電子束光刻膠：electron beam resist
X射線光刻膠：X-ray resist
刷洗：scrubbing
甩膠：spinning
塗膠：photoresist coating
後烘：postbaking
光刻：photolithography
X射線光刻：X-ray lithography
電子束光刻：electron beam lithography
離子束光刻：ion beam lithography
深紫外光刻：deep-UV lithography
光刻機：mask aligner
投影光刻機：projection mask aligner
曝光：exposure
接觸式曝光法：contact exposure method
接近式曝光法：proximity exposure method
光學投影曝光法：optical projection exposure method
電子束曝光系統：electron beam exposure system
分步重複系統：step-and-repeat system
顯影：development
線寬：linewidth
去膠：stripping of photoresist
氧化去膠：removing of photoresist by oxidation
等離子［體］去膠：removing of photoresist by plasma
刻蝕：etching
幹法刻蝕：dry etching
反應離子刻蝕：reactive ion etching,：RIE
各向同性刻蝕：isotropic etching
各向異性刻蝕：anisotropic etching
反應濺射刻蝕：reactive sputter etching
離子銑：ion beam milling，又稱「離子磨削」。
等離子［體］刻蝕：plasma etching
鑽蝕：undercutting
剝離技術：lift-off technology，又稱「浮脫工藝」。
終點監測：endpoint monitoring
金屬化：metallization
互連：interconnection
多層金屬化：multilevel metallization
電遷徙：electromigration
回流：reflow
磷矽玻璃：phosphorosilicate glass
硼磷矽玻璃：boron-phosphorosilicate glass
鈍化工藝：passivation technology
多層介質鈍化：multilayer dielectric passivation
劃片：scribing
電子束切片：electron beam slicing
燒結：sintering
印壓：indentation
熱壓焊：thermocompression bonding
熱超聲焊：thermosonic bonding
冷焊：cold welding
點焊：spot welding
球焊：ball bonding
楔焊：wedge bonding
內引線焊接：inner lead bonding
外引線焊接：outer lead bonding
梁式引線：beam lead
裝架工藝：mounting technology
附著：adhesion
封裝：packaging
金屬封裝：metallic packaging
陶瓷封裝：ceramic packaging
扁平封裝：flat packaging
塑封：plastic package
玻璃封裝：glass packaging
微封裝：micropackaging，又稱「微組裝」。
管殼：package
管芯：die
引線鍵合：lead bonding
引線框式鍵合：lead frame bonding
帶式自動鍵合：tape automated bonding, TAB
雷射鍵合：laser bonding
超聲鍵合：ultrasonic bonding
紅外鍵合：infrared bonding