塑膠電鍍原理及注意事項 Principles of Plating
第一步 素材選擇 ABS塑料案例
Step 1: Selecting Material ABS Plastic Case
1、最好採用電鍍級ABS塑膠（丁二烯含量15%~16% 附著強度最好）。
Selects the ABS plastics which the butadiene is 15%-16%.Its adhesion is best.
2、採用70%~95%PC+ABS材料要請供應商提供防火材料%、PC%等相關資料。
Applier should offer fireproof material, PC%, etc, and references before selecting 70%-95%PC+ABS.
3、塑膠電鍍原料應完全乾燥(含水率0.1%以下)。
Materials of plating on plastic should be dried totally.
4、塑膠電鍍原料儘量避免染色。Materials of plating on plastic must prevent dyeing.
5、塑膠電鍍原料必須通過UL認證。
Materials of plating on plastic should be attested by UL.
第二步 模具設計
Step 2: Mould Design
1、塑膠電鍍模具必須預留電鍍夾具掛架點(以防產品變形及生產便利性)。
Remains points for electroplating rack in mould of plating on plastic.
2、模具設計趨向：耐高溫、不易頂開產生毛邊、射出點不可太細以防入水斷裂、脫落、預防尖端放電(加框)、注意脫模斜度、預留排氣孔、注意頂針粗細影響外觀及進膠口位置產生的結合線等。
Trend of moulds design: Moulds should of be resistant to high temperature and not easily open to create crude outline, the ejection point should not be too small to prevent entering water and breaking. Prevents discharge of tip. Reminds the ventilator. Pays attention to that thickness of tip will influence the exterior and the combination line created in the ejection hole.
3、塑膠電鍍模具成型儘量避免尖端設計，儘可能改為R角。
Adopts round corner instead of tip corner in mould design.
4、模具孔洞儘量設計導通，預防殘留藥水不易清洗。
Designs passage in the hole to clean the remnants.
5、模具需預留電鍍後膜厚及組裝間隙。
Remain the thickness of membrane which formed after electroplating.
第三步 成型射出
Formation and Ejection
1、脫模劑最好不要用，要用務必使用含氟水性脫模劑。
Avoid using the mould releases, if it is essential to use one, the Fluorine-type may be used springly.
2、射出參數在不頂模、不起毛邊狀況下，儘可能拉高樹脂溶解溫度及模具溫度，降低射出壓力及射出速度，以減少應力產生。
The ejection parameter such as plastic Tm and mould temperature should rise as high as possible and the ejection stress and speed should be reduced to lessen the stress.
3、成形表面確認：不可有結合線、刮痕、頂凸、拉模、縮水、起蒼、包風、及異色點(浮出表面上)等等。
Affirming the surface: There must be no combination line, scratch, etc.
4、成型品包裝：用Tray(託盤)+紙箱，以防碰刮傷
Packing: adopt tray and paper case to prevent being scratched.
5、尺寸確認：依廠商訂定長寬尺寸、範圍。
Affirming the size: decides the size and range of length and width according to the requirement of the firm.
第四步 防鍍方式
Step 4: Methods of Plating-proof
1、與機構R&D、RF、EMI、ESD、電子等人員討論絕緣區位置、熱溶點位置、卡勾防鍍、耳機孔回朔、EMI歐姆值。
Discusses position of insulation area and melting point, plating-proof of hooks in rack, EMI ohm.
2、防鍍方式：噴塗、貼膠、蝕刻、照影 、印刷 (依需求而決定)。
Method of Plating-proof: spraying paint, etching, printing, etc. (decided by requirements)
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