1.0 Purpose 目的
Write a standard process to controlthe usage of solder paste to assure the quality of solder paste soldering制定一個標準管控條件以保證焊錫質量.
2.0 Scope 適用範圍
Tamura、Henkeltypes for solder paste in G-pro.
公司使用的Tamura、Henkel錫膏。
3.0 Definition 定義
無
4.0 Relativedocuments 相關文件
NA 略
5.0 Responsibility 責任
Theoperator should follow the process and IPQC should audit it to insure theProcess to carry out in practices.
製程管控室人員按此程序作業,IPQC檢查此程序執行的真實性.
6.0 Procedure 作業程序
6.1 When incomingmaterial, conform whether solder paste’s packing use Styrofoam and have ice bagin packing box ,if not according to foregoing requests or the ice alreadydissolve should not accept;
進料時，確認錫膏的包裝方式是否使用保麗龍材料且包有冰袋與溫度計(或溫度指示卡),如果沒有按上述要求包裝、冰袋內的已經融化、溫度指示卡溫度超過28度則拒籤收，並且還要將開箱之溫度記錄表進料批次報表中(WI-PMEG-001-Form01-B);
6.2 lead free Solderpaste storage time is six month for (0-10℃)，Lead Solder paste storagetime is three month for (0-10℃). conform excess EXP.DATE,IF excess EXP.DATE, should not accept. and 14 days in room temperatureenvironment; do not store below 0℃ , otherwise, solder paste chemistry character will be destroied.
無鉛錫膏保質期在冷藏環境(0-10℃)可保存6個月，有鉛錫膏保質期在冷藏環境(0-10℃)可保存3個月。確認保存期限(錫膏廠商標註在錫膏瓶上的)，若超過保存期限，拒絕籤收。錫膏於室溫環境可保存14天，錫膏切勿存放於0℃以下之環境,否則將會破壞錫膏之化學物質.
6.3 New solder paste should mark income No.,put it in icebox, please follow No to put solder paste.
有鉛錫膏與無鉛錫膏分開放置，不能放置於同一冰箱內.剛進的新錫膏請按進料的批號，貼上錫膏管控標籤,並掃描,然後放入冰箱內，按序號的大小，大號的放裡層，小號的放外層。 取出時，按序號及批號的大小，先取小的，再取大的.
< Modify> 6.4 All solder paste should between4 ~45 hrs go to room temp., and record the time scan the label, over 45 hrs toget scrap。
<修改>)所有錫膏回溫時間均需在室溫下回溫4~45小時內,並於取出時填上取出時間,錫膏取出回溫時需掃描，回溫超過45小時的錫膏將不再使用，直接報廢。
6.5 When the bottle is open, the lead solder pastemust be used up within 24 hours , and RoHS 12 hours , Henkel 96SCLF328DAP88.5 mustbe used up within 8 hrs , or else, it must be returned to the supplier orcollected to deal with.
有鉛錫膏開封後需於室溫下24小時內使用完, 無鉛錫膏開封後須於室溫環境在下12小時內用完，Henkel 96SCLF328DAP88.5開封8小時內使用完，若超過使用時間，即貼上禁用標籤並放於報廢區.若未超出開封期限，請轉移生產同樣產品的線別使用，如無使用相同產品的線別，請將此錫膏報廢處理。
6.6 The NG solder paste should put in NG solderpaste area, ADM should reclaim and give it to supplier every Monday.
報廢錫膏需放在報廢錫膏放置區,每周一由管理部回收,並讓採購交由廠商帶回處理。
6.7 Before using, it should be stirred so as to fixthe tin and flux well enough . Theoperation time pls ref date sheet .if use machine to do , the time must not beover 0.6 minutes, and manual is 15 cycles.
錫膏使用前要加以攪拌讓錫粉和助焊劑能混合,攪拌時間請參考錫膏之DATE SHEET,若為機器攪拌, 只能攪拌0.6分鐘，手攪15圈，攪拌前需要確認錫膏是否已經回溫OK。
6.9 Solder paste save condition should be controlledbetween2-8, If exceed, temperature announciator can trumpet. Kester &Tamura .If the refrigerator is beyond the standard, please immediately move thesolder to another one (within the standard), and pick out 1 or 2 bottle ofsolder to do the viscosity test .As to defective refrigerator, please notifyelectrician or relative staff to repair it, after it has been repaired well,observe for 1 or 2 days and confirm it is really ok, and then it can be used.
錫膏冷藏為0-10℃，報警界限為2-8℃, 每兩小時由JIT室人員檢查溫度並如實的記錄在(WI-PMEG-001-FROM05內),並計算每天的平均值埴寫在管制圖中﹐若超出報警界限2-8度時溫度報警器會報警,通知電工進行調整﹐冰箱若超出範圍(0-10 ℃)﹐請立即通知電工或相關人員進行維修並記錄不良的現象和改善對策﹐若是冰箱壞掉須轉移至另外一臺溫度達標的冰箱﹐並抽1-2瓶進行粘度測試﹐不良冰箱維修OK後觀察1-2天無異常後﹐方可使用.
6.10 The different type can not be mixture to use， LF solder paste will not becompatible with leaded reflow temp requirement
錫膏廠家不同及型號不同不得混合使用，無鉛錫膏不能和有鉛的回焊溫度的兼容.
6.11According to the date and color which is stick on carton to manage. The rule isFIFO .do not stick
The same label because of the same work order, itshould do according the arrived time to do.
依據label的顏色來進行FIFO的動作控管,每批進料需以製造的LOTNO相同而貼上相同的號碼及顏色label.
6.12 The supplier should do the same FIFO in orderto avoid the solder paste with the same Lot NO are mixed.
要求廠商也需做到FIFO的控管,以避免產生入廠錫膏之LOTNO混亂的情形。
6.13 Theoperator should go and get a bottle of solder paste once a time each line. Whenuse up, it must be sent to JIT to get anther, and make a record at the sametime. JIT operator will put the empty bottle to assign place and send to ADM tohandle on Monday, Wednesday and Friday every week.
每條線只能保持一瓶錫膏，空瓶請送到JIT室一對一更換，並紀錄之。JIT人員請將空瓶放置於空瓶放置區，每周一，三，五將空瓶送至管理部指定地點。
6.13 Please refer to related model working instruction to add solder paste.
添加錫膏之作業請參照各機種WI.
6.14 Color definition顏色定義
The 1st group: brown color; the 2ndgroup: red color; the 3rd group: orange color;
The 4th group: yellow color;the 5th group: green color; the 6th group: Blue color
The 7th group: Purplecolor; the 8th group: Grey color; the 9th group: whitecolor
The 10th group: black color
一批：棕色;二批:紅色;三批:橙色;四批:黃色;五批:綠色;六批:藍色;七批:紫色;八批:灰色；
九批:白色;十批:黑色，依此循環使用.
Operatorcollects, first key in work NO, work order, line and Model, then scan label ,then enter
Operator 領取,先輸入領取人工號,工單號,線別及機種,然後掃描label,最後領出使用.
6.18 All the solder paste is controlled by FIFO. If not ,the SFC will suggest. if such thing happys, the JIT worker and operator should review together,analysis the cause, provide the strategy, and record the CAR.(refer toSOP-PQA-018)
所有錫膏領取都按FIFO管制，如果未按FIFO管制，SFC將會提示此瓶序號不是下一瓶生產所需要的序號，發生此類問題，JIT人員將會同產線作業員一起作檢討，並分析原因，提出對策，記錄於CAR，CAR格式參見SOP-PQA-018.
6.19 Thesolder paste code principle:錫膏label編碼原則如下:
Remark:
第一碼為錫膏品牌﹕K 代表Kester、T 代表 Tamura、J代表PF305、F代表Formosa
M代表Henkel系列錫膏
第三碼為生產批號的月份,1,2,3……月用1,2,3表示,10,11,12月用A,B,C表示
第十碼為進料批次碼，第1批，就用1表示，依次類推，第10批則以「A」表示
7.0Appendix 附件
7.1錫膏進料管制表
7.2 The recovery temperature management and forbidto use label as list
.錫膏領用管制之表和禁止使用標籤樣品如下:
Solder pasteuse control from Forbidto use label Lot No.
錫膏領用管制表 禁止使用標籤 批號
7.3 Scrapsolder paste control報廢錫膏管制表
7.4 use solder paste record年錫膏使用記錄表
7.5 SolderAdding Time Record List錫膏添加時間記錄表與錫膏使用選擇要求.
7.6 Icebox temp record冰箱溫度記錄
7.5 Solder paste SFC control flow 錫膏SFC流程
1﹑程序主界面
2﹑操作步驟 Operating Steps
2.1.產生錫膏序號 Serial Number
Different solder paste has differentforbidden time. 90 days for lead-free one, and 120 days for lead one. Theforbidden time also is determined by the production time. The lot number can be 0-C (1~9, A, B, C ) inthe system. All the serial number of the same lot can be got out at the sametime. The quantity must fill into the quantity blank.
選擇相應的品牌﹐系統根據品牌確定禁用日期﹐其中有鉛品牌為90天﹐無鉛為120天﹐根據禁用日期生產日期向後推延(系統自動將廠商禁用日期提前7天，畫面中Vender DOE為廠商禁用日期)。批號系統默認為1﹐根據需要可以從1到C（1~9﹐A）﹐同一批次序號同時產生﹐在數量欄輸入產生數量。
The Principle of the Serial Number: Code 1 is themajuscule letter of the first letter of the brand; code 2 is the product year;code 3 is product month; code 4 and 5 is product date; code 6 is the forbiddenyear; code 7 is the forbidden month; code 8 & 9 is the forbidden date; code10 to 14 is the stream number. We must add P as the last code for the LF.
產生序號規則為﹕第一碼﹐品牌名稱前一位大寫﹐第二碼﹐生產年份﹐第三碼﹐生產月份﹐第四五碼﹐生產日期﹐第六碼﹐禁用年份﹐第七碼﹐禁用月份﹐第八九碼﹐禁用日期﹐第十到十四碼﹐流水碼﹐如果是無鉛﹐最後加上一碼為P﹐有鉛錫膏產生的號碼為14碼﹐無鉛錫膏15碼。系統自動將發放日期提前七天，例如：一瓶錫膏禁用日期為7月23日，則7月16日系統將管制不能放出此瓶錫膏(禁用日期=Vender 禁用日期-7天)。下圖中「Vender DOE」為廠商禁用日期
2. 3﹑Getting out from the refridgerate
錫膏出冰箱
Choose the brand and scan. The system will judgeautomatically: 1. dose the serial number exists: 2. does the brand match theserial number; 3. does the solder paste store in the fridge; 5. does the solderpaste discard as useless; 6. has the solder paste sent to the productstreamline.
選擇出冰箱的錫膏的品牌﹐然後掃描出冰箱的錫膏號碼。系統判斷﹕1﹑序號是否存在﹔2﹑品牌與所掃序號是否匹配﹔3﹑錫膏是否已經入冰箱﹔4﹑錫膏是否可用﹐即沒有報廢﹔5﹑錫膏是否已經出冰箱﹔6﹑錫膏是否已經發到產線。
2. 4﹑Fetch solder paste產線領用
The operator should input the person’sID, solder paste’s brand, the shift of process and the model. Then scan andsend out the solder paste. The system will verify 1. Whether solder pasteexists; 2. Whether the brand chose match the solder paste scanned; 3. Whethersolder paste is in stockroom; 4. Whether solder paste is out of the fridge; 5.Whether solder paste can be used; 6. Whether solder paste has been sent to theprocess; 7. Whether the ramp time is in the range that the system setted; 8.When sending out the solder paste, every one must input the serial number.
需要輸入領用人工號﹐所發到的工單﹐所發品牌﹐產線線別﹐機種。然後掃描發出錫膏。系統判斷﹕1﹑錫膏是否存在﹔2﹑所選擇品牌與掃描錫膏是否匹配﹔3﹑錫膏是否已經入庫﹔4﹑錫膏是否已經出冰箱﹔5﹑錫膏是否可用﹔6﹑錫膏是否已經發到產線﹔7﹑錫膏回溫時間是否在系統默認時間範圍內；8.發放每一瓶錫膏時需要輸入錫膏批號。
2. 5﹑Recycle回收錫膏瓶
Input the operator’s ID, scan the S/N ofthe solder paste. The system will verify: 1. whether the solder paste exists;2. whether the solder paste has been recycled; 3. whether the solder paste isout of the fridge; 4. whether the solder paste has been sent to the process.Once recycled, the solder paste can not be used again.
輸入回收人工號﹐掃描回收錫膏序號。系統判斷﹕1﹑錫膏是否存在﹔2﹑錫要是否已經回收﹔3﹑錫膏是否出冰箱﹔4﹑錫膏是否發到產線。錫膏一旦回收﹐就不可再用。
2. 6﹑外包Outer parking
Input starting and ending number ofsolder paste’s outer parking. Once outer parked no use again.
輸入外包錫膏起始與結束號碼。錫膏一旦外包﹐不可再使用。
2.7﹑Inputting Solder paste’s basicdata錫膏基本數據輸入
Input the model of the solder paste willbe used on, choose appropriate brand name and get the elements of the solderpaste, make sure whether it is ROHS.
輸入錫膏所要用到的機種﹐選擇相應的品牌﹐得到錫膏的合金成分﹐已及是否有鉛。
2.8﹑Inquire the data of solder paste.錫膏數據查詢
Scanningin an S/N we can get the present information of the solder paste. Such as whetherthe S/N exists, whether the solder paste is in fridge or out fridge, or whetherit is ready to use. Information of all solder paste can be obtained.
掃描進一個錫膏序號﹐可以查詢到該錫膏當前狀況﹐是否存在該序號﹐是否入庫 ﹐出庫﹐可用等。也可以查詢所有的錫膏信息。
2.9﹑The quantity of solder pastestatistics錫膏數量統計
You can inquire only one. Or you caninquire comprehensively: choose brand, model, the starting time and the endingtime then you can get what you want.
可以單獨查詢﹐也可做綜合查詢﹐選擇品牌﹐機種﹐起始結束時間。